- PCB Design and Assembly Service
- 2019-10-24 19:35
- Surface Mount Technology/ Parts (SMT Assembly)Through-Hole Device/ Parts (THD)Mixed Parts: SMT & THD assemblyBGA/ Micro BGA/ uBGAQFN, POP & lead-less chips2800 pin-count BGA0201/ 1005 passive components0.3/ 0.4 PitchPoP PackageFlip-chip under-filled CCGAB
- PCB Produce and Assembly
- 2019-10-22 16:33
- CapabilitiesSurface Mount Technology/ Parts (SMT Assembly)Through-Hole Device/ Parts (THD)Mixed Parts: SMT & THD assemblyBGA/ Micro BGA / uBGAQFN, POP & lead-less chips2800 pin-count BGA0201/ 1005 passive components0.3/ 0.4 PitchPoP PackageFlip-chip under
- SMT PCB Layout
- 2019-10-09 08:41
- (1) Gerber data for all artwork layers(2) Aperture list or lists for all layers(3) Drill file in Gerber or Excellon format(4) Drawings: Print should be hard copy or Gerber HPGL or DXF format
- PCB Design Service
- 2019-09-14 18:58
- Surface Mount Technology/ Parts (SMT Assembly)Through-Hole Device/ Parts (THD)Mixed Parts: SMT & THD assemblyBGA/ Micro BGA/ uBGAQFN, POP & lead-less chips2800 pin-count BGA0201/ 1005 passive components0.3/ 0.4 PitchPoP PackageFlip-chip under-filled CCGAB
- Turnkey PCB Design
- 2019-07-07 15:57
- Laminates: FR4(TG130, TG150, TG170), High frequency, Halogen free, Aluminum baseLayers: 1-32Max Size: 800mm X 650mmMin.Board Thickness: 2L: 0.20mm, 4L: 0.40mm, 6L:0.60mm, 8L:0.80mm, 10L:1.20mmFinished Copper: Inner:12-175um Outer:35-350umMin.Line/Space: 3